HT1623/HT1623G    RAM Mapping 48x8 LCD Controller for I/O MCU

Revision # 1.90    Modifications made on July 22, 2011

• The Gold Bump part number has been deleted in the datasheet header.

Revision # 1.80    Modifications made on April 29, 2011

• In the Features section and other related sections, the 100-pin QFP package was changed to 100-pin LQFP.
  
• The A.C. Characteristics section was modified.

Revision # 1.70    Modifications made on November 9, 2010

• In the A.C. Characteristics table, the t_RSTD entry was added and Figure 4 was modified.
• The note below the Internal Resistor Type Bias Generator Configurations diagram was modified.
• The Package Information section was modified.

Revision # 1.60    Modifications made on September 2, 2010

• The Gold Bump part number has been added to the datasheet header.

Revision # 1.50   Modifications made on June 17, 2009

• In the Features section, the package information was modified.

Revision # 1.40   Modifications made on May 26, 2009

• In the A.C. Characteristics section, the t_OFF and t_SR entries and other related Note description & Figure were added.
  
• In the Pad Assignment section, the Bump information was added.

Revision # 1.30   Modifications made on March 19, 2009

• In the Features section, the “Cascade application” item was removed.

Revision # 1.20   Modifications made on December 3, 2008

• The A.C. Characteristics section was modified.
  
• The Pad Assignment section was modified.
  
• The Pad Coordinates section was modified.

Revision # 1.11   Modifications made on September 25, 2008

• A Patent Notice has been added to the datasheet.

Revision # 1.10   Modifications made on September 11, 2002

• At the Pad Description table, the description for the falling edge and rising edge of the RD were interchanged.
• Package Information section was added.