Holtek Products' Lead(Pb)-free package meet RoHS Requirement

1. Holtek has already started to supply customers with environmentally friendly Lead Free devices in order to reduce or eliminate hazardous substances contained within the packaging. Holtek guarantees that its product contents will conform to the limitation of Lead(Pb), Cadmium(Cd), Mercury(Hg), Chromium(Cr6+), PBB and PBDE, all of which are banned under the RoHS Directive.

2. A the present time the complete range of Holtek's devices are fully in compliacne with the RoHS directive.

3. The following are the six device package types which take priority, namely: SOT-89, TO-92, SOP, DIP, QFP and QFN, as well as an introduction to other definitions and distinguishing types:

1. Definition: Lead-free products use pure Tin (Sn) as the plating materials instead of the usual Lead/Tin (PbSn) alloy in the current standard process. This is shown in the following picture marked in red for the Lead frame Plating, Sn.

2. The pure Tin (Sn) alloy products can be distinguished by examining the IC top markings and the labeling on the outer carton as shown in the following table:

Product Type		Top mark on IC	Special marking on the label of outer carton
			Mark	Date Code	QA column
SOT-89	Pure Sn	7550-1#	7550-1#	E7070E1
TO-92	Pure Sn	7136B-1	7136B-1	EC022K2#
SOP Series	Pure Sn	HT1621B	HT1621B	A606G0125#1
DIP Series	Pure Sn	HT9302G	HT9302G	A614K0013#4A
QFP Series	Pure Sn	HT95C300-000F	HT95C300-000F	A601K0012#
QFN Series	Pure Sn	HT82K68A-002T	HT82K68A-002T	FC003A4#

Label example  SOT-89

Lead free

Label example TO-92

Lead free

Label example SOP Series

Lead free

Label example DIP Series

Lead free

Label example QFP  Series

Lead free

Label example QFN  Series

Lead free

Reliability Testing of Holtek's Lead-free products

Remark:

• Electrical "OPEN" will be occurred when the Pb free device was used in IR Reflow profile of Pb coating device.

• PCB with mixed Pb coating & Pb free devices should adopt the "IR Reflow Profile of Pb free". (Higher soldering temperature range : 260℃)

• Wide temperature coefficient Pb coating devices suggested to be adopted in PCB and must pass "Precondition Test".