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Holtek Products' Lead(Pb)-free package meet RoHS Requirement
Holtek has already gradually started to supply customers with environmentally friendly Lead Free devices,
in order to reduce or eliminate the hazardous substances in packaging. We guarantee Holtek's product contents will conform to the limitation of Lead(Pb), Cadmium(Cd), Mercury(Hg), Chromium(Cr6+), PBB and PBDE which are banned by the RoHS Directive.
Presently the complete range of Holtek's devices are fully in compliacne with the RoHS directive.
The following are the six device package types which take priority, nameley SOT-89, TO-92, SOP,
DIP, QFP and QFN, as well
as an introduction to other definitions and distinguishing types:
Definition : Lead-free products apply matte Tin (Sn) as the plating materials instead of the alloy of Lead and Tin (PbSn) in current standard process. It's shown as following picture marked by red color for "Lead frame Plating, SnPb or
Sn.

How to distinguish the products between matte Tin (Pure Sn) and the alloy of Lead and Tin (SnPb) for the two items of top mark on IC and special marking on the label of outer carton. For example:
Label example SOT-89
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Lead free |
Non Lead free |
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Label example TO-92
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Lead free |
Non Lead free |
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Label example SOP Series
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Lead free |
Non Lead free |
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Label example DIP Series
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Lead free |
Non Lead free |
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Label example QFP Series
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Lead free |
Non Lead free |
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Label example QFN Series
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Lead free |
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Holtek's Lead-free products meet the regulations of
the RoHS directive, the Laboratory Analytical Report about six hazardous substances
are shown in the attached files:
P-DIP & SOP & SSOP & SOJ & SOT SGS Report
PLCC SGS Report
QFN SGS Report
QFP &LQFP SGS Report
TO SGS Report
QFP & LQFP & TQFP SGS Report
CHIP SGS REPORT
Reliability Testing of Holtek's Lead-free products
Remark:
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Electrical "OPEN" will be occurred when the Pb free device was used in IR Reflow profile of Pb coating device.
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PCB with mixed Pb coating & Pb free devices should adopt the "IR Reflow Profile of Pb free". (Higher soldering temperature range : 260℃)
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Wide temperature coefficient Pb coating devices suggested to be adopted in PCB and must pass "Precondition Test".
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