Holtek Products' Lead(Pb)-free package meet RoHS Requirement

Holtek has already gradually started to supply customers with environmentally friendly Lead Free devices, in order to reduce or eliminate the hazardous substances in packaging. We guarantee Holtek's product contents will conform to the limitation of Lead(Pb), Cadmium(Cd), Mercury(Hg), Chromium(Cr6+), PBB and PBDE which are banned by the RoHS Directive.

Presently the complete range of Holtek's devices are fully in compliacne with the RoHS directive.

The following are the six device package types which take priority, nameley SOT-89, TO-92, SOP, DIP, QFP and QFN, as well as an introduction to other definitions and distinguishing types:

Definition : Lead-free products apply matte Tin (Sn) as the plating materials instead of the alloy of Lead and Tin (PbSn) in current standard process. It's shown as following picture marked by red color for "Lead frame Plating, SnPb or Sn.

How to distinguish the products between matte Tin (Pure Sn) and the alloy of Lead and Tin (SnPb) for the two items of top mark on IC and special marking on the label of outer carton. For example:

Product Type Top mark on IC Special marking on the label of outer carton

Mark

Date Code QA column
SOT-89 Pure Sn 7550-1# 7550-1# E7070E1  
SnPb

7550-1

7550-1 E7070E1  
TO-92 Pure Sn 7136B-1 7136B-1 EC022K2#  
SnPb 7136B-1 7136B-1 EC022K2  
SOP Series Pure Sn HT1621B HT1621B A606G0125#1  
SnPb HT1621B HT1621B A535G1242-1  
DIP Series Pure Sn HT9302G HT9302G A614K0013#4A  
SnPb HT9302G HT9302G A548G1112-4A  
QFP Series Pure Sn HT95C300-000F HT95C300-000F A601K0012#  
SnPb HT95C300-000F HT95C300-000F A601K0011  
QFN Series Pure Sn HT82K68A-002T HT82K68A-002T FC003A4#  

Label example  SOT-89

Lead free

Non Lead free

 

Label example TO-92

Lead free

Non Lead free

 

Label example SOP Series

Lead free

Non Lead free

 

Label example DIP Series

Lead free

Non Lead free

 

Label example QFP  Series

Lead free

Non Lead free

 

Label example QFN  Series

Lead free

 

Holtek's Lead-free products meet the regulations of the RoHS directive, the Laboratory Analytical Report about six hazardous substances are shown in the attached files:
P-DIP & SOP & SSOP & SOJ & SOT SGS Report
PLCC SGS Report
QFN SGS Report
QFP &LQFP SGS Report
TO SGS Report
QFP & LQFP & TQFP SGS Report
CHIP SGS REPORT


Reliability Testing of Holtek's Lead-free products

Remark:

  • Electrical "OPEN" will be occurred when the Pb free device was used in IR Reflow profile of Pb coating device.

  • PCB with mixed Pb coating & Pb free devices should adopt the "IR Reflow Profile of Pb free". (Higher soldering temperature range : 260℃)

  • Wide temperature coefficient Pb coating devices suggested to be adopted in PCB and must pass "Precondition Test".