Reliability Testing of Holtek's Green Package Products

The following four package types using Tin plating and Halogen Free mouldings have passed the Reliability Test, qualification test and give the following results:

Testing items
Packaging types
Precondition TCT PCT Solder ability
SOT-89 PASS PASS PASS PASS
SOP series PASS PASS PASS PASS
QFP series PASS PASS PASS PASS
QFN series PASS PASS PASS PASS

Test conditions for reliability testing are defined as follows:

No. Test Item Sample Size Accept
/ Reject		 LTPD% Reference Test Condition
1 Precondition 45 0/1 5% J-STD-020
Level 3 		TCT:-65°C~150°C, 5cycles
Baking: 125°C, 24hrs
Soaking:60°C/60%RH, 40hrs
IR Reflow: 260¡Ó2°C, 3cycles
2 Temperature Cycling Test(TCT: Air to Air) 45 0/1 5% MIL-STD-883E
1010.7		 -65°C¡K¡K¡K¡K¡K¡K150°C
(10min  <5min   10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 45 0/1 5% JEDEC-A121 Ta=121°C,100%RH ,
168hrs, 15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003 		1. Steam Age 8hrs

2. 245°C+-5°C, 5sec

5¡@ Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25¡Ó5°C, 30~80%RH1000Hrs
Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60¡Ó5°C, 90¡Ó5%%RH1000Hrs

The Standard IR reflow temperature profiles for J-STD-020-D are shown as follows:

Actual IR reflow temperature profile is as below:

 

The attachment is the testing detail of Reliability for your reference

JEDEC Standard Spec : J-STD-020-D

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