Reliability Testing of Holtek's Lead-free products

Following two packaging types by matte Tin plating have passed the Reliability Test, qualification testing items and results are shown as follows: (The qualification report of SOT-25 is also referred to the one of SOT-89)

Testing items
Packaging types
Precondition TCT PCT Solderability
SOT-89 PASS PASS PASS PASS
TO-92 N/A PASS PASS PASS
SOP Series PASS PASS PASS PASS
DIP Series N/A PASS PASS PASS
QFP Series PASS PASS PASS PASS
QFN Series PASS PASS PASS PASS

Testing conditions of Reliability are defined as follows:

No. Test Item Sample Size Accept/Reject LTPD% Reference Test Condition
1 Precondition 55 1/2 7% A113-A
J-STD-020C
Level 3 		TCT:-65¢J~150¢J, 5cyclesBaking: 125¢J, 24hrsSoaking: 30¢J/60%RH, 192hrsIR Reflow:260¢J(-5, 0), 3cycles
2 Temperature Cycling Test(TCT: Air to Air) 55 1/2 7% MIL-STD-883E
1010.7 		-65 ¢J ~ 150 ¢J(10min 10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 55 1/2 7% JEDEC-A121 Ta=121¢J,100%RH , 168Hrs,15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003 		1. Steam Age 8hrs

2. 245¢J+-5¢J, 5sec

5 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25¡Ó5¢J, 30~80%RH1000Hrs
¡@ Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60¡Ó5¢J, 90¡Ó5%%RH1000Hrs

The Standard IR reflow temperature profile of J-STD-020-C are shown as follows:

Actual IR reflow temperature profile for SOT-89 is as below:

The attachment is the testing detail of Reliability for your reference

JEDEC Standard Spec : J-STD-020-C

¡@

¡@

¡@