Reliability Testing of Holtek's Lead-free products

The following six packaging types which have pure Tin plating have passed the Reliability Test and qualification testing items for which the results are shown as follows: (The SOT-25 qualification report also refers to the SOT-89)

Testing items
Packaging types
Precondition TCT PCT Solder ability
SOT-89 PASS PASS PASS PASS
TO-92 N/A PASS PASS PASS
SOP Series PASS PASS PASS PASS
DIP Series N/A PASS PASS PASS
QFP Series PASS PASS PASS PASS
QFN Series PASS PASS PASS PASS

Testing conditions of Reliability are defined as follows:

No. Test Item Sample Size Accept
/ Reject		 LTPD% Reference Test Condition
1 Precondition 45 0/1 5% J-STD-020
Level 3 		TCT:-65°C~150°C, 5cycles
Baking: 125°C, 24hrs
Soaking:60°C/60%RH, 40hrs
IR Reflow: 260¡Ó2°C, 3cycles
2 Temperature Cycling Test(TCT: Air to Air) 45 0/1 5% MIL-STD-883E
1010.7		 -65°C¡K¡K¡K¡K¡K¡K150°C
(10min  <5min   10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 45 0/1 5% JEDEC-A121 Ta=121°C,100%RH ,
168hrs, 15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003 		1. Steam Age 8hrs

2. 245°C+-5°C, 5sec

5¡@ Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25¡Ó5°C, 30~80%RH1000Hrs
Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60¡Ó5°C, 90¡Ó5%%RH1000Hrs

The Standard IR reflow temperature profile of the J-STD-020-D are shown as follows:

The actual IR reflow temperature profile is shown below:

 

The attachment is the testing detail of Reliability for your reference

JEDEC Standard Spec : J-STD-020-D

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