March 2006

  • Holtek Semiconductor achieves successful OHSAS 18001 accreditation by the Occupational Health & Safety Management System of the Taiwan branch of TUV Asia Pacific Ltd.

December 2005

  • Received R & D accomplishment award from the Hsinchu Science Park authorities.

November 2005

  • Holtek holds its first MCU innovation competition.

October 2005

  • Holtek formally establishes design center.

December 2004

  • Holtek was granted with an Outstanding Financial Performance by a Public Company Award as recognized by the Fabless Semiconductor Association (FSA).

September 2004

  • Holtek is formally public listed on Taiwan Stock Exchange Company (TSEC).

September 2003

  • Holtek Semiconductor obtains the Bronze Medal for the 12th National Innovation Award.

March 2003

  • ISO14001 certified for establishment of Environmental Management System.

November 2002

  • Holtek is formally public listed on Taiwan Over-The-Counter (OTC) Securities Exchange.

November 2001

  • US subsidiary formally established with responsibilities for the North American region sales and technology support.

March 2001

  • Shanghai subsidiary formally established with responsibilities for the China mainland region sales and technology support.

May 2000

  • Holtek Semiconductor obtains official approval for full stock market public listing.
  • ISO9001 certified for Design, Development and Supply of Integrated Circuits.

April 2000

  • Hong Kong company branch formally established, responsible for overseas distribution, warehousing and logistical support.

December 1999

  • Hong Kong subsidiary formally established, commenced operations with sales and technology support for the Hong Kong region.

March 1999

  • Increase in capital stock of 600 million NT, Holtek's capital stock now stands at 1 billion NT.

October 1998

  • In line with industry trends and to maintain its competitive edge, the company, now reorganized as Holtek Semiconductor Inc., redirected and concentrated its efforts in the area of IC design, founded with a capital stock of 400 million NT.

April 1998

  • Joint venture with UMC.

October 1997

  • Completed installation of FAB II eight inch ULSI wafer facility and commenced manufacture.

December 1990

  • Completed installation of its FAB I five inch VLSI wafer facility and commenced manfacture.

July 1988

  • Expanded its range of operations by opening its wafer manufacturing facilities in the Hsinchu Science Park and adopting the new name of Holtek Microelectronics Inc.

March 1983

  • Holtek Semiconductor Corp. formally established as an IC design house in Taipei, marking the beginning of its growth and progress.