e-FPCB Flex Cable Converter

Due to the different OCDS EV types, it is not always possible that their package types will be the same as the actual IC. For this reason Holtek supplies a flex cable converter which allows the user to make the necessary modifications

 

e-FPCB 轉接軟板e-FADPXXX 2×6 Pin Double-Row Male Headers

 

Item Box content item name Number
1 e-FADPXXX 10
2 2×6 Pin Double-Row Male Headers 10

 Combined products and optional accessories: e-Link

e-Link e-FPCB OCDS EV 應用板

e-FPCB and e-Link Usage Diagram - Note that OCDS EV is purchased seperately

Item

Part Number

Function

1 e-FADP06T Converts 16NSOP package EV to SOT23-6 pin type
2 e-FADP08N The e-FADP08N will transform the 16NSOP EV package type into an 8SOP package type, allowing the 16-pin EV device to be used for 8SOP package type MCUs. VDD is located on PIN 1 and VSS located on Pin 8.
3 e-FADP08D The e-FADP08D will transform the 16NSOP EV package type into an 8DIP package type, allowing the 16-pin EV device to be used for 8DIP package type MCUs. VDD is located on PIN 1 and VSS located on Pin 8.
4 e-FADP08N3 The e-FADP08N3 will transform the 16NSOP EV package type into an 8SOP/DIP package type, allowing the 16-pin EV device to be used for 8SOP package type MCUs. VDD is located on PIN 3 and VSS on Pin 2.
5 e-FADP10N3 The e-FADP10N3 will transform the 16NSOP EV package type into a 10SOP package type, allowing the 16-pin EV device to be used for 10SOP package type MCUs. VDD is located on PIN 3 and VSS on Pin 2.
6 e-FADP10M2 The e-FADP10M2  will transform the 16NSOP EV package type into a 10MSOP package type, allowing the 16-pin EV device to be used for 10MSOPpacakge type MCUs. VDD is located on PIN 1 and VSS on Pin 10
7 e-FADP10N2 The e-FADP10N2 will transform the 16NSOP EV package type into a 10SOP package type, allowing the 16-pin EV device to be used for 10SOPpacakge type MCUs. VDD is located on PIN 1 and VSS on Pin 10.